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s eptember 2013 r e v 5 1/26 26 vnd600 double channel high-s ide solid-state relay features cmos-compatible input proportional load current sense shorted load protection under-voltage and over-voltage shutdown over-voltage clamp thermal shutdown current limitation protection against loss of ground and loss of v cc very low standby power dissipation reverse battery protected (see application sc hematic ) description the vnd600 is a double chip device designed in stmicroelectronics vipower m0-3 technology. the vnd600 is intended for driving any type of load with one side connected to ground. the active v cc pin voltage clamp protects the device against low energy spikes (see iso7637 transient compatibility table). acti ve current limitation combined with thermal shutdown and automatic restart protects the device against over-load. the device integrates an analog current sense output which delivers a current proportional to the load current. the device automatically turns off in the case where the ground pin becomes disconnected. type r ds(on) i out v cc vnd600 35 m ? 25 a (1) 1. per channel with all the out put pins connected to the pcb. 36 v so-16l table 1. device summary package order codes tube tape and reel so-16l vnd600 VND60013TR www.st.com
contents vnd600 2/26 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1 gnd protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16 3.1.1 solution 1: resistor in the ground line (rgnd only) . . . . . . . . . . . . . . . . 16 3.1.2 solution 2: diode (dgnd) in the ground line . . . . . . . . . . . . . . . . . . . . . 17 3.2 load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.3 mcu i/os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.4 maximum demagnetization energy (vcc = 13.5v) . . . . . . . . . . . . . . . . . 18 4 package and pcb thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.1 so-16l thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.1 ecopack ? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.2 so-16l packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
vnd600 list of tables 3/26 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 table 3. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 5. power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 6. switching (v cc =13v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 7. v cc output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 8. logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 9. current sense (9v vcc 16v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 10. protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 11. truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 12. electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 table 13. thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 14. so-16l mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 15. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
list of figures vnd600 4/26 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 4. switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 5. i out /i sense versus i out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 6. waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 7. off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 8. high-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 9. input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 10. turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 11. over-voltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 12. turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 13. ilim vs tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 14. on-state resistance vs vcc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 15. input high-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 16. input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 17. on-state resistance vs tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 18. input low-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 19. application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 20. maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 21. so-16l pc board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 22. rthj-amb vs pcb copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 19 figure 23. thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 24. thermal fitting model of a quad channel hsd in so-16l . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 25. so-16l package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 26. so-16l tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 figure 27. so-16l tape and reel shipment (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
vnd600 block diagram and pin description 5/26 1 block diagram and pin description figure 1. block diagram figure 2. configuration diagram (top view) table 2. suggested connections for unused and not connected pins connection / pin current sense n.c. output input floating x x x to ground through 1k resistor x through 10k resistor logic undervoltage overvoltage overtemp. 1 overtemp. 2 i lim2 pwclamp 2 k i out2 i lim1 pwclamp 1 k i out1 input 1 input 2 gnd v cc output 1 current sense 1 output 2 current sense 2 driver 2 driver 1 v cc clamp ot1 ot2 ot1 ot2 v dslim1 v dslim2 v cc output 1 output 1 output 1 output 2 v cc output 2 output 2 v cc c. sense 2 c. sense 1 input 1 input 2 v cc gnd n.c. 1 8 9 16
electrical specifications vnd600 6/26 2 electrical specifications figure 3. current and voltage conventions note: v fn = v ccn - v outn during reverse battery condition. 2.1 absolute maximum ratings stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not imp lied. exposure to absolute ma ximum rating conditions for extended periods may affect device reliability. refer also to the st microelectronics sure program and other relevant quality document. i s2 i gnd2 output2 v cc2 i out2 v cc2 v sense2 current sense 1 i sense1 v out2 output1 i out1 current sense 2 i sense2 v sense1 v out1 input2 i in2 input1 i in1 v in2 v in1 ground2 i s1 v cc1 v cc1 i gnd1 ground1 v f1 (*) table 3. absolute maximum ratings symbol parameter value unit v cc dc supply voltage 41 v - v cc reverse dc supply voltage - 0.3 v - i gnd dc reverse ground pin current - 200 ma i out dc output current internally limited a - i out reverse dc output current - 21 a i in dc input current +/- 10 ma v csense current sense maximum voltage - 3 + 15 v v v esd electrostatic discharge (human body model: r = 1.5k ; c = 100pf) input current sense output v cc 4000 2000 5000 5000 v v v v
vnd600 electrical specifications 7/26 2.2 thermal data symbol parameter value unit e max maximum switching energy (l = 0.12mh; r l = 0 ; v bat = 13.5v; t jstart = 150oc; i l = 40a) 136 mj p tot power dissipation t c 25c 8.3 w t j junction operating temper ature internally limited c t c case operating temperature - 40 to 150 c t stg storage temperature - 55 to 150 c table 3. absolute maximum ratings (continued) table 4. thermal data (per island) symbol parameter value unit r thj-lead thermal resistance junction-lead 15 c/w r thj-amb thermal resistance junction-ambient 65 (1) 1. when mounted on a standard single-sided fr-4 board with 0.5cm 2 of cu (at least 35 m thick) connected to all v cc pins. horizontal mounting and no artificial air flow. 48 (2) 2. when mounted on a standard single-sided fr-4 board with 6cm 2 of cu (at least 35 m thick) connected to all v cc pins. horizontal mounting and no artificial air flow. c/w
electrical specifications vnd600 8/26 2.3 electrical characteristics values specified in this section are for 8v < v cc < 36v; -40c < t j < 150c, unless otherwise stated. note: v clamp and v ov are correlated. typical difference is 5v. table 5. power symbol parameter test conditions min. typ. max. unit v cc operating supply voltage 5.5 13 36 v v usd under-voltage shutdown 3 4 5.5 v v ov over-voltage shutdown 36 v r on on-state resistance i out = 5a; t j = 25c; i out = 5a; t j = 150c; i out = 3a; v cc = 6v 35 70 120 m m m v clamp clamp voltage i cc = 20ma 41 48 55 v i s supply current off-state; v cc = 13v; v in = v out = 0v off-state; v cc = 13v; v in = v out = 0v; t j = 25 c on-state; v cc = 13v; v in = 5v; i out = 0a; r sense = 3.9 k 12 12 40 25 6 a a ma i l(off1) off-state output current v in = v out = 0v 0 50 a i l(off2) off-state output current v in = 0v; v out = 3.5v -75 0 a i l(off3) off-state output current v in = v out = 0v; v cc = 13v; t j = 125c 5a i l(off4) off-state output current v in = v out = 0v; v cc = 13v; t j = 25c 3a table 6. switching (v cc =13v) symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time r l = 2.6 (see figure 4. )30s t d(off) turn-off delay time r l = 2.6 (see figure 4. )30s dv out /dt (on) turn-on voltage slope r l = 2.6 (see figure 4. ) see figure 10. v/s dv out /dt (off) turn-off voltage slope r l = 2.6 (see figure 4. ) see figure 12. v/s table 7. v cc output diode symbol parameter test conditions min. typ. max. unit v f forward on voltage - i out = 2.3 a; t j = 150c 0.6 v
vnd600 electrical specifications 9/26 table 8. logic inputs symbol parameter test conditions min. typ. max. unit v il input low-level voltage 1.25 v i il low-level input current v in = 1.25v 1 a v ih input high-level voltage 3.25 v i ih high-level input current v in = 3.25v 10 a v i(hyst) input hysteresis voltage 0.5 v v icl input clamp voltage i in = 1ma i in = - 1ma 66.8 - 0.7 8v v table 9. current sense (9v v cc 16v) symbol parameter test conditions min. typ. max. unit k 1 i out /i sense i out = 0.5a; v sense = 0.5v; t j = -40c...150c 3300 4400 6000 dk 1 /k 1 current sense ratio drift i out = 0.5a; v sense = 0.5v; t j = - 40c...150c - 10 + 10 % k 2 i out /i sense i out = 5a; v sense = 4v; t j = - 40c t j = 25c...150c 4200 4400 4900 4900 6000 5750 dk 2 /k 2 current sense ratio drift i out = 5a; v sense = 4v; t j = -40c...150c - 6 + 6 % k 3 i out /i sense i out = 15a; v sense = 4v; t j = -40c t j = 25c...150c 4200 4400 4900 4900 5500 5250 dk 3 /k 3 current sense ratio drift i out = 15a; v sense = 4v; t j = -40c...150c - 6 + 6 % v sense max analog sense output voltage v cc = 5.5v; i out = 2.5a; r sense = 10k v cc > 8v, i out = 5a; r sense = 10k 2 4 v v v senseh sense voltage in over-temperature condition v cc = 13v; r sense = 3.9k 5.5 v r vsenseh analog sense output impedance in over-temperature condition v cc = 13v; t j > t tsd ; output open 400 t dsense current sense delay response to 9 0 % i sense (1) 1. current sense signal delay after positive input slope. 500 s
electrical specifications vnd600 10/26 table 10. protections (1) 1. to ensure long term reliability under heavy over-load or short circuit conditions , protection and related diagnostic signals must be used together with a pro per software strategy. if the device operates under abnormal conditions this software must limit the duration and number of activation cycles. symbol parameter test conditions min. typ. max. unit t tsd shutdown temperature 150 175 200 c t r reset temperature 135 c t hyst thermal hysteresis 7 15 c i lim current limitation v cc = 13v 5v < v cc < 36v 25 40 70 70 a a v demag turn-off output clamp voltage i out = 2 a; v in = 0v; l = 6mh v cc - 41 v cc - 48 v cc - 55 v v on output voltage drop limitation i out = 0.5 a; t j = -40c...150c 50 mv table 11. truth table conditions input output sense normal operation l h l h 0 nominal over-temperature l h l l 0 v senseh under-voltage l h l l 0 0 over-voltage l h l l 0 0 short circuit to gnd l h h l l l 0 (t j t tsd ) v senseh short circuit to v cc l h h h 0 < nominal negative output voltage clamp l l 0
vnd600 electrical specifications 11/26 figure 4. switching characteristics table 12. electrical transient requirements iso t/r 7637/1 test pulse test level i ii iii iv delays and impedance 1- 25v (1) 1. all functions of the device are performed as designed after exposure to disturbance. - 50v (1) - 75v (1) - 100v (1) 2ms, 10 2 + 25v (1) + 50v (1) + 75v (1) + 100v (1) 0.2ms, 10 3a - 25v (1) - 50v (1) - 100v (1) - 150v (1) 0.1s, 50 3b + 25v (1) + 50v (1) + 75v (1) + 100v (1) 0.1s, 50 4- 4v (1) - 5v (1) - 6v (1) - 7v (1) 100ms, 0.01 5+ 26.5v (1) + 46.5v (2) 2. one or more functions of the device is not perfor med as designed after exposure and cannot be returned to proper operation without replacing the device. + 66.5v (2) + 86.5v (2) 400ms, 2 v out dv out /dt (on) t r 80% 10% t f dv out /dt (off) i sense t t 90% t d(off) input t 90% t d(on) t dsense
electrical specifications vnd600 12/26 figure 5. i out /i sense versus i out 0 2 4 6 8 10 12 14 16 3000 3500 4000 4500 5000 5500 6000 6500 min.tj=-40c max.tj=-40c min.tj=25...150c max.tj=25...150c typical value i out /i sense i out (a)
vnd600 electrical specifications 13/26 figure 6. waveforms sense input normal operation undervoltage v cc v usd v usdhyst input overvoltage v cc sense input sense load current load current load current v ov v ovhyst v cc > v usd short to ground input load current sense load voltage input load voltage sense load current electrical specifications vnd600 14/26 2.4 electrical characteristics curves figure 7. off-state output current figure 8. high-level input current -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 il (off1) (ua ) off state vcc=36v vin=vout=0v -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 iih (ua ) vin=3.25v figure 9. input clamp voltage figure 10. turn-on voltage slope -50 -25 0 25 50 75 100 125 150 175 tc (c ) 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10 vicl (v) iin=1 ma -50 -25 0 25 50 75 100 125 150 175 tc (oc ) 250 300 350 400 450 500 550 600 650 700 dvout/dt(on) (v/ms) vcc=13v rl=1.3ohm figure 11. over-voltage shutdown figure 12. turn-off voltage slope -50 -25 0 25 50 75 100 125 150 175 tc (c ) 30 32 34 36 38 40 42 44 46 48 50 vov (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 200 250 300 350 400 450 500 550 600 dv out/dt(off) (v /ms) ri=6.5ohm
vnd600 electrical specifications 15/26 figure 13. i lim vs t case figure 14. on-state resistance vs v cc -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 2 4 6 8 10 12 14 16 18 20 ilim (a ) vcc=13v 5 10152025303540 vcc (v) 0 10 20 30 40 50 60 70 80 ron (mohm) io u t =5 a tc = 150c tc = 25c tc = - 40c figure 15. input high-level figure 16. input hysteresis voltage -50 -25 0 25 50 75 100 125 150 175 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 vih (v) -50 -25 0 25 50 75 100 125 150 175 tc (c) 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 vhyst (v) figure 17. on-state resistance vs tcase figure 18. input low-level -75 -50 -25 0 25 50 75 100 125 150 175 tc (c) 0 10 20 30 40 50 60 70 80 90 100 ron (mohm) io u t =5 a vcc =8v & 36v -50 -25 0 25 50 75 100 125 150 175 tc (c) 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 vil (v)
application information vnd600 16/26 3 application information figure 19. application schematic 3.1 gnd protection networ k against reverse battery 3.1.1 solution 1: resist or in the ground line (r gnd only) this can be used with any type of load. the following is an indication on how to dimension the r gnd resistor. 1. r gnd 600mv / (i s(on)max ). 2. r gnd ( - v cc ) / (- i gnd ) where - i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. power dissipation in r gnd (when v cc < 0: during reverse battery situations) is: p d = (- v cc ) 2 / r gnd this resistor can be shared amongst several different hsds. please note that the value of this resistor should be calculated with formula (1) where i s(on)max becomes the sum of the maximum on-state currents of the different devices. please note that if the microprocessor ground is not shared by the device ground then the r gnd will produce a shift (i s(on)max * r gnd ) in the input thresholds and the status output values. this shift will vary depending on how ma ny devices are on in the case of several high-side drivers sharing the same r gnd . if the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then st suggest s to utilize solution 2 (see below). v cc1 output2 c. sense 1 d ld +5v r prot output1 r sense1,2 input1 c. sense 2 input2 c r prot r prot r prot d gnd r gnd v gnd gnd1 gnd2 v cc2
vnd600 application information 17/26 3.1.2 solution 2: diode (d gnd ) in the ground line a resistor (r gnd = 1k ) should be inserted in parallel to d gnd if the device drives an inductive load. this small signal diode can be safely shared amongst several different hsds. also in this case, the presence of the grou nd network will produce a shift ( 600mv) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. this shift will not vary if more than one hsd shares t he same diode/resistor network. series resistor in input and status lines are also required to prevent that, during battery voltage transient, the current exceeds the absolute maximum rating. safest configuration for unused input and status pin is to leave them unconnected. 3.2 load dump protection d ld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the v cc max dc rating. the same applies if the device is subject to transients on the v cc line that are greater than the ones shown in the iso 7637-2: 2004(e) table. 3.3 mcu i/os protection if a ground protection network is used and negative transient are present on the v cc line, the control pins will be pulled negative. st suggests to insert a resistor (r prot ) in line to prevent the c i/os pins to latch-up. the value of these resistors is a compromise between the leakage current of c and the current required by the hsd i/os (input levels compatibilit y) with the latch-up limit of c i/os. -v ccpeak /i latchup r prot (v oh c -v ih -v gnd ) / i ihmax calculation example: for v ccpeak = - 100v and i latchup 20ma; v oh c 4.5v 5k r prot 65k . recommended values: r prot =10k .
application information vnd600 18/26 3.4 maximum demagnetization energy (v cc = 13.5v) figure 20. maximum turn-off current versus inductance note: values are generated with r l =0 . in case of repetitive pulses, t jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves a and b. c: t jstart = 125c repetitive pulse a: t jstart = 150c single pulse b: t jstart = 100c repetitive pulse demagnetization demagnetization demagnetization t v in , i l 1 10 100 0.01 0.1 1 10 100 l(mh) i lmax (a) a b c
vnd600 package and pcb thermal data 19/26 4 package and pcb thermal data 4.1 so-16l thermal data figure 21. so-16l pc board note: layout condition of r th and z th measurements (pcb fr4 area = 41mm x 48mm, pcb thickness = 2mm, cu thickness = 35m, copper areas: 0.5cm 2 , 6cm 2 ). figure 22. r thj-amb vs pcb copper area in open box free air condition 40 45 50 55 60 65 70 01234567 pc b c u heatsink area (cm^ 2) rth j-amb (c/ w)
package and pcb thermal data vnd600 20/26 figure 23. thermal impedance junction ambient single pulse equation 1 : pulse calculation formula figure 24. thermal fitting model of a quad channel hsd in so-16l 0.01 0.1 1 10 100 1000 0.0001 0.001 0.01 0.1 1 10 100 1000 time (s) zt h (c / w) footprint 6 cm 2 z th r th z thtp 1 ? () + = where t p t ? = t_amb pd1 c1 r4 c3 c4 r3 r1 r6 r5 r2 c5 c6 c2 pd2 r2 c1 c2 r1 tj_1 tj_2
vnd600 package and pcb thermal data 21/26 table 13. thermal parameters area / island (cm 2 ) footprint 6 r1 (c/w) 0.05 r2 (c/w) 0.3 r3 (c/w) 2.2 r4 (c/w) 12 r5 (c/w) 15 r6 (c/w) 37 22 c1 (w.s/c) 0.001 c2 (w.s/c) 5e-03 c3 (w.s/c) 0.02 c4 (w.s/c) 0.3 c5 (w.s/c) 1 c6 (w.s/c) 3 5
package and packing information vnd600 22/26 5 package and packing information 5.1 ecopack ? packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com. ecopack ? is an st trademark. figure 25. so-16l package dimensions
vnd600 package and packing information 23/26 table 14. so-16l mechanical data dim. mm. min. typ. max. a 2.65 a1 0.1 0.2 a2 2.45 b 0.35 0.49 b1 0.23 0.32 c0.5 c1 45 (typ.) d 10.1 10.5 e 10.0 10.65 e1.27 e3 8.89 f7.4 7.6 l 0.5 1.27 m 0.75 s 8 (max.)
package and packing information vnd600 24/26 5.2 so-16l packing information figure 26. so-16l tube shipment (no suffix) figure 27. so-16l tape and reel shipment (suffix ?tr?) all dimensions are in mm. base q.ty 50 bulk q.ty 1000 tube length ( 0.5) 532 a 3.5 b 13.8 c ( 0.1) 0.6 a c b base q.ty 1000 bulk q.ty 1000 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 16.4 n (min) 60 t (max) 22.4 tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb. 1986 all dimensions are in mm. tape width w 16 tape hole spacing p0 ( 0.1) 4 component spacing p 12 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 7.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions
vnd600 revision history 25/26 6 revision history table 15. document revision history date revision changes 07-jul-2004 1 initial release. 09-sep-2004 2 minor changes. current and voltage convention update (page 2). configuration diagram (top view) and suggested connections for unused and n.c. pins insertion (page 2). 6 cm2 cu condition insertion in thermal data table (page 3). v cc - output diode section update (page 4). revision history table insertion (page 34). disclaimers update (page 35). 03-may-2006 3 suggested connections for unused and n.c.pins correction. 17-dec-2008 4 document reformatted and restructured. added content, list of figures and tables. added ecopack ? packages information. 25-sep-2013 5 updated disclaim er.
docid8942 rev 5 26/26 vnd600 26 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. a ll st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industr y domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - italy - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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